1. Diamond layer get thicker, from less than 1mm to the current 2-4mm, the life of the product will be improved.
2. The diamond grains are getting thinner and finer, and the PDC CUTTER comprehensive performance of wear resistance and impact resistance will be improved.
3. Improve thermal stability by optimizing the process or removing Co, will increasing the heat resistance layer and other processes.
4. Optimization of interface structure to improve interface stress.
5. The diameter of the product continues to increase, and the synthesis efficiency will be improved.
6. Improve the sintering effect and reduce the performance difference.